Solid State Technology and Devices Seminar: Microassembler Printer

Seminar: Solid State Technology and Devices | October 12 | 1-2 p.m. | Cory Hall, 521 Hogan Room

 Eugene Chow, PARC

 Electrical Engineering and Computer Sciences (EECS)

We are developing a process to assemble and orient micro-objects, and then transfer them to a final substrate to be used for electronics, sensors, metamaterials and other applications. The process uses directed electrostatic assembly to enable micrometer scale registration and parallel assembly with open and closed loop control. We transfer the assemblies to final substrates with parallel or roll based-based methods.

 CA, m.rivera@eecs.berkeley.edu, 5106423214