Seminar | October 13 | 1-2 p.m. | Cory Hall, 521 Cory (Hogan Room)
Daniel Gitlin, CEA-Leti
A standard cost model used in the Industry is extended to 3D systems. Examples of applications of this model will be provided and contrasted against Moore's law. Both monolithic technology migrations and new integration technologies balance manufacturing complexity vs. footprint reduction. The net result can only be quantifies with adequate models that illustrate the trade-offs and help extract adequate technology targets and applicability range. The talk will cover Moore's law, Chip-on-wafer as well as monolithic 3D technologies.