Special EECS Seminar: Chip design and system building techniques at the interface: enabling new wireless sensors

Seminar: Departmental | February 11 | 1-2 p.m. | Soda Hall, Wozniak Lounge (430)

Speaker: Brian Otis, Associate Professor, University of Washington

Sponsor: Electrical Engineering and Computer Sciences (EECS)

Advances in chip and system design will help define the next generation of wireless sensors. I’ll discuss examples of our work that have enabled new collaborative science. We will then cover chip design techniques for body-worn/implantable systems and wireless sensors. Finally, I’ll present examples of future mainstream constantly connected devices for improving healthcare. These areas present tough unsolved problems at the interface between the IC and the outside world that cannot be solved by transistor technology scaling alone. Several future applications will demand thin-film realization and biocompatibility of complex systems. Novel power sources, microscale resonator technologies, and new system integration techniques will be enabling technologies for these emerging systems.

Bio: Brian Otis received the B.S. degree in electrical engineering from the University of Washington, Seattle, and the M.S. & Ph.D. degrees in electrical engineering from UC Berkeley. He is an Associate Professor of Electrical Engineering at the University of Washington and holds a position at Google, Inc. His research interests are low power chip design, wireless system integration, MEMS/FBAR resonator based clocks, and bioelectrical interface circuits and systems.

Event Contact: richter@eecs.berkeley.edu, 510-643-8208